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Jobs and careers temporary for lead informatica iics engineer from the company Acnovate corporation in San Francisco (1 jobs)

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Advanced Packaging Design Engineer PCB / Substrate / 2.5D3D - Bay Area, CA

  • Acnovate Corporation
  • San Francisco
Description: Advanced Packaging Design Engineer PCB / Substrate / 2.5D 3DLocation: Bay ... an experienced Advanced Packaging Design Engineer to drive next-gen package ... AI, and networking products. Responsibilities: Lead package/substrate design feasibility for ...
25 days ago

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