... 3 to 8+ years in IC package design and development. Proficiency with Cadence ... Package Designer. Experience in Wire bond, Flip chip Substrate designs. ... -on-Substrate) interposer design and the impact of ... the substrate design to support CoWoS. Knowledge ...
28 days ago
Description: Design & Implementation: Develop RTL code (Verilog, ... functional simulation, debug FPGA designs, and resolve design issues. Validation & Testing: Create ... unit tests, example designs, and demos; ensure readiness of ...
10 days ago
... : Experienced (> 5y) Signal & Power Integrity Engineer to support high-speed interfaces ... , PCIe, UCIe standards and PDN design best practices. Strong analytical and ...
30 days ago
... , Artifact Registry). Proven ability to design and implement end-to-end ...
23 days ago