Description:
Company:Qualcomm Technologies, Inc. Job Area:Engineering Services Group, Engineering Services Group > Engineering Technician General Summary: Member of the Packaging Lab team, providing hands on support for mechanical characterization of automotive IC packages and modules. The qualified candidate will be responsible for operating a variety of test equipment, including thermal cycle chambers, mechanical shock testers, and data acquisition. Responsible for operation and maintenance of test equi
Apr 13, 2024;
from:
dice.com