Description:
Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence. Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging. Familiarity with image sensors and camera modules would be a plus 7-10 years' of experience in hands-on Package/Module/PCB design BS/MS/equivalent experience in engineering; PhD preferred
Apr 24, 2025;
from:
dice.com