Description:
Job Title: Principal Advanced Packaging Engineer Semiconductor & Chiplet Integration Location: Santa Clara, CA Visas: and H1b Industry: Semiconductor | Microelectronics | Advanced Packaging Experience Level: Senior (10+ Years) Position Summary We are seeking an experienced Principal Advanced Packaging Engineer with deep expertise in semiconductor packaging, chiplet integration, and high-speed interconnect design. This role will lead advanced packaging development efforts for next-generation AI
Apr 30, 2025;
from:
dice.com