Description:
Piper Companies is looking for a CoWoS Principle Packaging Engineer who will construct and enhance Chip-on-Wafer-on-Substrate packaging technology to support high-performance AI and data center applications onsite in Saratoga, CA . The ideal CoWoS Principle Packaging Engineer will collaborate with cross-functional teams to facilitate smooth integration of advanced multi-die packages. Responsibilities for the CoWoS Principle Packaging Engineer: Lead the advancement of CoWoS packaging technolog
May 2, 2025;
from:
dice.com