Description:
CoWoS Packaging Engineer Location - Bay Area, CA - Candidate can be relocated to the bay Position Overview We are seeking a skilled and motivated CoWoS Packaging Engineer to join our growing team. This role focuses on the development and optimization of Chip-on-Wafer-on-Substrate (CoWoS) packaging technology to support high-performance AI and data center applications. You will collaborate with design, process, manufacturing, and materials teams to enable seamless integration of advanced multi-di
May 13, 2025;
from:
dice.com