Description:
This role is highly specialized in semiconductor packaging design, requiring strong EDA tool proficiency and knowledge of advanced packaging technologies. Key Responsibilities & Skills: Tools & Knowledge: Mentor/Siemens and Cadence tools (especially for Package Layout Automation - PLA). Technical Expertise: Multi-layer package design experience. Understanding of substrate manufacturing Design Rules and Assembly Rules. Familiarity with SIPI (Signal Integrity & Power Integrity) Rules. Flip-c
Nov 20, 2025;
from:
dice.com