Where

ADVANCED IC PACKAGE DESIGN ENGINEER (COWOS / 2.5D PACKAGING)

Galaxy Infotech INC
Santa Clara Full-day Full-time

Description:

Must share LinkedIn URL along with DL Copy Advanced IC Package Design Engineer (CoWoS / 2.5D Packaging)Marvell Santa Clara, CA (Onsite) 6-12 months ongoing (in a perfect world would want a FT conversion) Manager wants to see people that can fully work onsite CADENCE ADP is the most important thing, a small write up would go a long way with this manager. 2 interviews, first one with team lead, second one with manager and director (will be a Microsoft Teams video call) Requirements: Bachelor s de
Dec 8, 2025;   from: dice.com

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