Where

Packaging Engineer (ICs/Sensors)

Oxford Global Resources
Fremont Full-day Temporary

Description:

Title Packaging Engineer Location Onsite in Fremont, CA Duration 6-12 months, Contract-to-Hire Ideal Start 3/2 or 3/9 Interview Process 2 Rounds MS Teams Video CallOnsite/Group MS Teams InterviewUS Persons, Drug Test, & Background Check Required Scope: Oxford s client is in need of a packaging engineer to join their manufacturing team. They are looking for someone with a degree in Mechanical, Electrical, or Manufacturing to work on packaging for sensors (temperature, pressure, ICs, etc). This is
Feb 16, 2026;   from: dice.com

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