... internal testing throughout product development - Support hardware and software computer setup ...
4 days ago
Description: Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence. Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging. ...
23 hours ago
... Experience with PICOF/PECI in supporting Payroll integrations is desirable. Experience ...
3 days ago