Description: Package Design Engineer in the US, ... knowledge Multiple layers package design (8+) experience Understanding of substrate ... manufacturing design rule and assembly rule ... Possess Flip Chip Package Design Concept Good communication skill. ...
15 days ago
Description: Hardware Design Engineer Location: USA Chandler Exp: 5 + ... Signal integrity, Power Integrity, Hardware design, Digital System Design, EDA tools, CAD Tools ... PCIe Gen5/6, LPDDR5/6 Leading the design, development, and implementation of hardware ...
13 hours ago