Description: Package Design Engineer in the US, please share ... Cadence, PLA knowledge Multiple layers package design (8+) experience Understanding of substrate manufacturing ... assembly rule Possess Flip Chip Package Design Concept Good communication skill. May ...
17 days ago
Description: Hardware Design Engineer Location: USA Chandler Exp: 5 + years ... experience Key skills: Server Board design, Digital&Power Electronics, Microcontroller, ... integrity, Power Integrity, Hardware design, Digital System Design, EDA tools, CAD Tools ...
2 days ago