Description: Requirements/Skills: Possess Mentor Graphics, Cadence, PLA knowledge Multiple layers package design (8+) experience Understanding of substrate manufacturing design rule and assembly rule Possess Flip Chip Package Design Concept Good ...

4 days ago

Get new software engineer jobs in San Jose by email

By creating a job alert, you agree to our Terms You can change your consent settings at any time by unsubscribing or as detailed in our terms.