Description: Key Responsibilities: Oversee preparation and execution of test readiness activities, including managing the transition from Surface-Mount Technology (SMT) to final assembly across all phases of product New Product Introduction (NPI) ...
a day ago
... Advanced Packaging Engineer Semiconductor & Chiplet Integration Location: Santa Clara, CA Visas ... , chiplet integration, and high-speed interconnect design. This role will lead advanced ...
3 days ago
... a CIM solution architect to lead the integration and enhancement of our world ...
2 days ago