... be similar to Post Silicon Engineer. Candidate Roles and Minimum Qualifications ...
26 days ago
Description: Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence. Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging. ...
6 days ago
... : SAP MII Developer SAP ME System (Manufacturing Execution) Hybrid: 3 days onsite ...
16 days ago