Description: Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence. Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging. ...
17 hours ago
... experience and its interaction with hardware Effective communication skills Ability to ...
16 hours ago
... 50 lbs+ to manage server hardware (unpacking, racking, configuration
3 days ago