Description:
Piper Companies is seeking a Director of Packaging Engineering - CoWoS to join our dynamic team onsite 5 days per week in Saratoga, CA. The Ideal Director of Packaging Engineering - CoWoS will spearhead the development and refinement of Chip-on-Wafer-on-Substrate packaging technology for high-performance AI and data center applications. Responsibilities for the Director of Packaging Engineering - CoWoS Lead the advancement of CoWoS packaging technology to enhance chip performance, power, and
Apr 30, 2025;
from:
dice.com