Description:
Title: Package Designer (Onsite - San Jose)Experience: 5+ Years We re looking for an experienced Packaging Designer to develop creative and cost-effective IC package designs. Job Description:Netlist & BGA creationSubstrate stack-up & routing strategy definitionExperience with RF, Digital, High-speed & Mixed-signal dieStrong knowledge of SI/PI requirements (DDR, SERDES, etc.)Expertise in UCIE (Advanced & Standard), HBM, CoWoS, 2.5D/3D, RDL, Flip Chip, and Wire Bond technologiesFamiliar with HDI s
Oct 31, 2025;
from:
dice.com