Description:
Job Summary This role is highly specialized in semiconductor packaging design, requiring strong EDA tool proficiency and knowledge of advanced packaging technologies. Key Responsibilities: Tools & Knowledge:Mentor/Siemens and Cadence tools (especially for Package Layout Automation - PLA).Technical Expertise:Multi-layer package design experience.Understanding of substrate manufacturing design rules and assembly rules.Familiarity with SIPI (Signal Integrity & Power Integrity) Rules.Flip-chip packa
Dec 11, 2025;
from:
dice.com