... PLA knowledge Multiple layers package design (8+) experience Understanding of substrate manufacturing ... design rule and assembly rule Possess ... Flip Chip Package Design Concept Good communication skill. May ...
6 days ago
... Multiple layers package design (8+) experienceUnderstanding of substrate manufacturing design rule and assembly ... rulePossess Flip Chip Package Design ConceptGood communication skill.May require ...
11 days ago
Description: Package Design Engineer in the US, ... knowledge Multiple layers package design (8+) experience Understanding of substrate ... manufacturing design rule and assembly rule ... Possess Flip Chip Package Design Concept Good communication skill. ...
12 days ago