Description: Package Design Engineer in the US, ... knowledge Multiple layers package design (8+) experience Understanding of substrate ... manufacturing design rule and assembly rule ... Possess Flip Chip Package Design Concept Good communication skill. ...
10 days ago
... PLA knowledge Multiple layers package design (8+) experience Understanding of substrate manufacturing ... design rule and assembly rule Possess ... Flip Chip Package Design Concept Good communication skill. May ...
4 days ago
... Multiple layers package design (8+) experienceUnderstanding of substrate manufacturing design rule and assembly ... rulePossess Flip Chip Package Design ConceptGood communication skill.May require ...
9 days ago