... :Multi-layer package design experience.Understanding of substrate manufacturing Design Rulesand Assembly Rules ... Integrity) Rules.Flip-chip package design concepts.Tasks:Perform point-to ... -point connections.Run DRC (Design Rule Checks), identify root causes ...
18 days ago
... highly specialized in semiconductor packaging design, requiring strong EDA tool proficiency ... :Multi-layer package design experience.Understanding of substrate manufacturing design rules and assembly ...
19 days ago