Description:
Key Responsibilities & Skills for Package Designer: Tools & Knowledge:Mentor/Siemens and Cadence tools (especially for Package Layout Automation - PLA).Technical Expertise:Multi-layer package design experience.Understanding of substrate manufacturing Design Rulesand Assembly Rules.Familiarity with SIPI (Signal Integrity & Power Integrity) Rules.Flip-chip package design concepts.Tasks:Perform point-to-point connections.Run DRC (Design Rule Checks), identify root causes, and fix issues.Execute des
Dec 12, 2025;
from:
dice.com