... highly specialized in semiconductor packaging design, requiring strong EDA tool ... Technical Expertise:Multi-layer package design experience.Understanding of substrate ... manufacturing design rules and assembly rules.Familiarity with SIPI (Signal Integrity ...
18 days ago
... Expertise:Multi-layer package design experience.Understanding of substrate ... manufacturing Design Rulesand Assembly Rules.Familiarity with SIPI (Signal Integrity & ... Power Integrity) Rules.Flip-chip package design concepts. ...
17 days ago