... Expertise:Multi-layer package design experience.Understanding of substrate ... manufacturing Design Rulesand Assembly Rules. ... Rules.Flip-chip package design concepts.Tasks:Perform point- ... point connections.Run DRC (Design Rule Checks), identify root ...
30 days ago
... highly specialized in semiconductor packaging design, requiring strong EDA tool ... Technical Expertise:Multi-layer package design experience.Understanding of substrate manufacturing ... design rules and assembly rules. ...
a month ago