Description:
We are seeking an experienced packaging designer to develop innovative and cost-effective packaging designs. JOB DESCRIPTIONNetlist creation, BGA creation as per the inputsConduct feasibility studies to advise optimum pad layout, interconnect types, and substrate parameters for a specific IC device or application.Define substrate stack-ups, routing strategies, and via structures.Substrate design experience for RF, digital, high-speed, and mixed signal dieExcellent understanding of SI/PI requirem
Nov 5, 2025;
from:
dice.com